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azonenberg>
Finally getting around to more fab work
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azonenberg>
Cleaving a 2-inch double-side-polish <110> wafer into quarters, RCA cleaning them
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azonenberg>
then one at a time spin coating both sides of two in ~50nm Ta2O5
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azonenberg>
then tomorrow evaporating Cu and Cr
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azonenberg>
if they pass adhesion testing in the HF tomorrow evening i will start doing some deep etch tests
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azonenberg>
as in 15 to >30 mins in KOH