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In-Vacuum Electronics for Microfabricated Ion Traps
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The AD5370’s and regulators are decapsulated from the packaged component to bare die; this is required to prevent outgassing of the molding plastic in the UHV ion trap environment. A jet etching technique with fuming nitric acid (HNO3) and sulfuric acid (H2SO4) dissolves the encapsulant on the package, leaving the die, bond pads, and wire bonds intact
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[artiq] sbourdeauducq pushed 1 new commit to master: http://git.io/2Z3G8Q