<B0101> hi
<azonenberg> Hopefully going to get some more litho work done this weekend
<azonenberg> The hope is to refine the liftoff process for the hardmask a little more
<azonenberg> In the meantime i'm starting a wiki page on the process
<Harold_parker> nice man
<Harold_parker> how'd you get on with those probes last night?
<azonenberg> I didnt do any more work since testing them on the pic a little
<azonenberg> it was enough to verify i could hit bond pads and other big stuff
<azonenberg> i dont need to do anythimg smaller until i get my process shrunk :p
<Harold_parker> ahh nice :)
<Harold_parker> excellent
<Harold_parker> yeh for sure man
<azonenberg> Is it bad that i recognized this SEM as a recent model Zeiss before even seeing the logo?
<azonenberg> But it seems strange to see someone using one of these things who isnt dressed in a bunny suit :p
<CIA-67> homecmos r92 | wiki/Si2DLithoProcess.wiki | Created wiki page through web user interface.
<azonenberg> Early draft, any thoughts? http://code.google.com/p/homecmos/wiki/Si2DLithoProcess
<bart416> Pictures!
<azonenberg> So I want to start exploring alternate hardmasks
<azonenberg> Ta2O5 is still worth looking into for when vacuum isnt available but i think i can get better results with evaporated Ni
<azonenberg> also patterned by liftoff
<azonenberg> Unfortunately i dont have a working evaporator yet
<berndj> what are you hoping to achieve with this hardmask stuff?
<berndj> and, does it relate to that PR "peeling" problem you were having?
<azonenberg> berndj: Yes
<azonenberg> A hardmask of some sort is necessary because photoresist is attacked by KOH and will disintegrate in seconds
<azonenberg> So you need a material that you can pattern using photoresist (by either lift-off or etching) and then use that material as a mask for the KOH etch
<azonenberg> Normally people use silicon nitride, iirc it's patterned by an HF wet etch
<azonenberg> But my resist is not very good against HF
<azonenberg> So I tried using lift-off, which works but i am having issues with so far
<berndj> KOH is to get the oxide off?  or to actualy "dig into" the silicon?
<azonenberg> KOh is for etching the silicon
<azonenberg> To significant depth (for MEMS applications)
<azonenberg> as in several microns to a few hundred microns
<berndj> was about to ask if this was for MEMS
<azonenberg> Yes, thats the main application
<berndj> didn't think you'd absolutely need that for making just circuits
<azonenberg> No, you typically dont
<berndj> for accelerometer type devices: how do you get "under" the probe mass?
<azonenberg> There are a couple of methods depending on the process
<azonenberg> I was going to use bulk micromachining and actually have it free hanging
<azonenberg> etch from the back up until the center of the die is only a few microns thick
<azonenberg> then do another etch from the top down with my target pattern
<azonenberg> Another is based on surface micromachining and involves depositing a sacrificial spacer followed by polysilicon
<azonenberg> you make the moving parts out of poly-si then dissolve the spacer
<azonenberg> presumably at some point in between you'd put support structures through the spacer layer to hold your device up
<berndj> isn't MEMS an order of magnitude harder to DIY than just "normal" devices (just circuits)?
<azonenberg> Not for something simple like a comb drive
<azonenberg> because CMOS is so sensitive to trace metal contamination
<berndj> i'm only assuming so because it's a decade or two or three further along in history
<azonenberg> mems dont really care
<azonenberg> And making really complex mems usually needs RIE
<azonenberg> But for simpler stuff, not necessary
<berndj> does NaOH also work to etch Si?
<azonenberg> Yes
<berndj> works too well?
<azonenberg> But KOH is apparently more repeatable
<azonenberg> In mixed signal CMOS+MEMS devices they usually use TMAH which is purely organic and has no metal ions
<berndj> TMAH?  geez, another james bond movie death-chemical!
<azonenberg> berndj: Lol
<azonenberg> What do you mean?
<azonenberg> It can be toxic but i'm not aware of it having been used in film :p
<berndj> just looking at its wikipedia article, that makes it sound like another one of those death-on-contact chemicals like HF
<azonenberg> It can definitely be nasty, i'm not planning to use it without more research
<azonenberg> Which is one of the reasons i am sticking with mems for the time being
<azonenberg> since i definitely dont need it
<azonenberg> i want to explore alternative photoresist developers, preliminary research suggests straight household ammonia might work
<berndj> if you can tell me a household-chemicals means of making PR (for pcb type resolution) i'll give you a wet sloppy kiss
<azonenberg> I'm not aware of any, chemistry isnt my main strong point lol
<azonenberg> i'm into this mostly for the engineering of devices
<azonenberg> the process development is a necessary step to make that happen
<berndj> maybe i'll just dick around sometime with indoor varnish + UV, see if anything looks workable
<berndj> my outdoor timber suggests there's some UV action, but i don't want to sit with multi-year exposures!
<azonenberg> lol :p