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<houkime>
FINALLY!. Looks like I have finally found a plausible solution!
<houkime>
Or at least a trace to it. this is awesome
<houkime>
we might need to add some esds though because thay can't be utilized 100% efficiently
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<knttl>
houkime: random 'thank you' for helping out the project :)
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<houkime>
although the problem with usb charger itself still remains. The thing is you can't just go over it like joerg says. It has a exp plate which blocks "go through". Interestingly enough other GTA04 variants solve this problem somehow but I can't find layout files.
<Joerg-Neo900>
short stubs don't matter
<Joerg-Neo900>
you don't need to "run the trace through the pin"
<Joerg-Neo900>
plus we got at very least 4 layers
<houkime>
It will need to be 2 short stubs with vias then/
<Joerg-Neo900>
so you actually can run the traces thoriugh the via in pad
<Joerg-Neo900>
though stubs are fine when they are not too long - maybe < 5mm
<houkime>
No, there won't be a real via in a pad. no need. I can make just a kittle bit thicker annual ring then. No solder needed here
<Joerg-Neo900>
:-)
<Joerg-Neo900>
i'd like to avoid in-pad vias on LOWER, I huess we can get away without them, they are expensive
<Joerg-Neo900>
we'll need them for OMAP though
<Joerg-Neo900>
and maybe actually need them for modem module LGA
<Joerg-Neo900>
on lower
<houkime>
Metacollin used many thermal vias in a pad.
<Joerg-Neo900>
then LGA are such miinster sized pads, a in-pad via wouldn't need to be plated, just capped or plugged
<Joerg-Neo900>
monster*
<Joerg-Neo900>
ooh, yeah. thermal vias. makes sense, those are plenty so we might actually need plated vias
<houkime>
they need to be plated. At least some of them. Otherwise they won't connect to the groundplane
<Joerg-Neo900>
hm? never heard that
<Joerg-Neo900>
I mean copper cap so you don't see the via anymore
<Joerg-Neo900>
not the via tube plating to make it conduct
<Joerg-Neo900>
a via without that is a drill
<Joerg-Neo900>
;-)
<houkime>
oh... Yep, my bad.
<Joerg-Neo900>
np, possibly my nomenclature is not in line with common usage
<Joerg-Neo900>
seems often they are called tented vias
<houkime>
nononono tented vias are separate
<Joerg-Neo900>
though in other docs "tented" means "covered by solder stop"
<houkime>
tented are about soldermask and conformal coating
<Joerg-Neo900>
seems there's a bazillion names for it
<Joerg-Neo900>
let's agree on open vias in pads are a poor idea that gives headache during assembly
<Joerg-Neo900>
so in-pad vias shall always be filled/plugged and covered by copper plating
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<Joerg-Neo900>
aiui you however need to think about which types of blind vias you want to mix on same board, PCB houses can't make arbitrary mixes
<houkime>
ok.
<Joerg-Neo900>
thanks to the fact that a multilayer PCB is just multiple 2layer laminated together by prepreg to form a stack, and blind vias are just "full" vias on a partial stack
<Joerg-Neo900>
so the sequence of stacking determines which blind vias can be done
<Joerg-Neo900>
*AIUI*
<Joerg-Neo900>
!!!
<Joerg-Neo900>
there of course are also stacked vias, though the jury seems to be still out on those
<Joerg-Neo900>
>>Furthermore, filled vias give designers exacting control of how operating heat is routed to the PCB's surface for its efficient dissipation<<