02:00 <mosquito520> lunra: Hm~ I mean... If the device is dongle type that the PCB will be limit into small size, Mechanical Engineer usually will add a thermal pad between chip and case, to dissipate heat by case.

02:02 <mosquito520> it's different to tablet, cuz tablet PCB size bigger, usually Layout engineer will trying place more copper as ground to dissipate heat,

02:04 <lunra> Ah, like that. I understand, that makes sense too

02:05 <mosquito520> and that "thermal layer" you mean, well, I m FW guys, so I don't know does that Layout engineer will using 1 layer just for thermal dissipate...I haven't check that yet, I check the layout only Top and bottom only :p

14:34 <shineworld> I'm a newbie used with linux-sunxi (kernel/android) that I'm moving to a rockchip board. There is a place (github or similary) where to find rockchip kernel and related android distro in sources ?

14:36 <hipboi> github.com/linux-rockchip

14:36 <hipboi> shineworld, if you have the radxa rock board

14:37 <hipboi> you can access the android source code

14:37 <hipboi> it's hosted on private git server now

14:38 <shineworld> hi hipboi, thanks for suggestion ... waiting for final version of radxa board (with BT) I'm using a normal tablet to test

14:39 <shineworld> so I can't access to your private repo