azonenberg changed the topic of #homecmos to: Homebrew CMOS and MEMS foundry design | Wiki: http://homecmos.drawersteak.com/wiki/Main_Page | Repository: http://code.google.com/p/homecmos/ | Logs: http://en.qi-hardware.com/homecmos-logs/
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<azonenberg> Sync__: are you familiar with antenna design rules?
<Sync__> well, depends on the antenna type azonenberg
<azonenberg> Sync__: As in, vulnerability of ICs to plasma damage
<Sync__> oh
<Sync__> well
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<azonenberg> i tried to FIB a chip after carbon coating it to reudce chargin
<azonenberg> charging*
<azonenberg> then strip in oxygen plasma
<azonenberg> repeated the experiment a week later
<azonenberg> 100% mortality rate
<azonenberg> neither survived
<azonenberg> i suspect the plasma clean was killing them
<azonenberg> do you think a QFP leadframe + bond wires will couple enough energy from an oxygen plasma to blow out pad drivers?
<Sync__> oh, certainly
<azonenberg> i was hoping that by putting the package on a grounded metal plate i'd be ok
<azonenberg> but it might not have made good contact
<azonenberg> So, let me rephrase the question
<azonenberg> if i want to do a fib circuit edit and not charge horribly
<azonenberg> what are my options?
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<Sync__> good question
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<Sync__> I'd try removing it from the leadframe
<Sync__> and possibly not running it through plasma
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<azonenberg> Well, if i remove it from the leadframe
<digshadow-w1> azonenberg: I met someone when I was up in SF with diamondman that might be interested in home CMOS stuff
<azonenberg> i am gonna have a pain testing the chip
<azonenberg> digshadow-w1: i need to get back to that
<azonenberg> havent had the time
<azonenberg> Sync__: unless we can get the wire bonder in the cleanroom working better than it is now :p
<Sync__> just rebond
<Sync__> oh
<Sync__> well
<Sync__> there is your issue :D
<azonenberg> We have issues with the bonder
<Sync__> you also do not need to have it in the cleanroom
<azonenberg> its in the offline test room
<azonenberg> attached to the cleanroom
<azonenberg> The engineer who runs the bonder made 3 bonds in a row yesterday before something malfunctioned
<azonenberg> this was a new record
<Sync__> what kind of RIE method?
<azonenberg> O2 plasma barrel etcher
<azonenberg> they usually use it for stripping PR
<Sync__> what does it use, capacitive RF or what?
<azonenberg> i think so? its a front loader with a hexagonal structure inside an outer cylinder
<azonenberg> pretty sure it strikes the plasma between those two pieces
<Sync__> okay
<Sync__> try to put a magnet under the chip
<Sync__> oh wait, thinking about it that might actually make it worse
<azonenberg> lol
<azonenberg> i dont want more plasma bombardment
<Sync__> is it rf or dc?
<azonenberg> rf
<Sync__> hmm
<azonenberg> I'm thinking i need to find an alternate way of mitigating charge in the fib
<azonenberg> this coating isnt the right option
<Sync__> I only ever done fib on solar cells
<Sync__> just had a quick read through some papers
<Sync__> and basically they tell, you are fucked.