azonenberg changed the topic of #homecmos to: Homebrew CMOS and MEMS foundry design | Wiki: http://homecmos.drawersteak.com/wiki/Main_Page | Repository: http://code.google.com/p/homecmos/ | Logs: http://en.qi-hardware.com/homecmos-logs/
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<yusuf2> i asked this on ##chemistry as well, but i thought i would ask here in addition
<yusuf2> i have a question. i've always had difficulty visualizing what would happen if you dipped a bulk material into some etchant that had a preferred crystal plane which it etched
<yusuf2> so for example, if i have something that looks like the cube in the bottom right here: http://1t2src2grpd01c037d42usfb.wpengine.netdna-cdn.com/wp-content/uploads/sites/2/2014/07/Haimei-pt-cube-il.jpg
<yusuf2> let's say that was silicon, because that is commonly used in many industrial applications
<yusuf2> and an anisotropic etch that is commonly used with it is KOH
<yusuf2> i think it prefers 100 and 111 is the slowest to etch. i'm not exactly sure why, because i thought the etch rate had to do with the number of available atoms per crystal plane and the number of atoms in the 111 plane is less than the number of atoms in the 100 plane
<yusuf2> so, if that object was dipped in KOH, what would happen? my imagination says that the 100 planes would "cave in" and the 111 planes wouldn't really have depleted much
<yusuf2> i'm not sure what would really happen to the 110 planes. is there something i can use to simulate this as well?