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15:41
<
_Sync__ >
tempering my diodes killed them :/
16:40
<
SpeedEvil >
Were they working before?
16:56
<
_Sync__ >
let me plot some data
17:02
<
_Sync__ >
30 s 350 °C kills the diodes ):
17:03
<
_Sync__ >
also the 50µ one sucked
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18:08
<
SpeedEvil >
(well - not the whole death thing)
18:08
<
SpeedEvil >
Is current reflected around the y Axis, or do I not understand semiconductor physcise enough?
18:16
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18:18
<
_Sync__ >
y axis is abs(log(I))
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18:25
<
_Sync__ >
heating them made fancy resistors out of them :/
18:27
<
SpeedEvil >
i assume without heating they'd have become rapidly unstable?
18:29
<
_Sync__ >
probably not
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20:47
<
azonenberg >
_Sync__: What are these?
20:47
<
azonenberg >
curve trace plots of homebrewed diodes?
20:48
<
azonenberg >
So I'm gonna be tinkering with flip-chip BGA packaging soonish
20:48
<
azonenberg >
Just an inert package, no active devices
20:49
<
azonenberg >
I'm gonna take a 4" wafer with thermal oxide on it, evaporate Cr adhesion layer followed by Cu metallization
20:49
<
azonenberg >
Coat photoresist as oxidation/particle barrier
20:49
<
azonenberg >
Score and cleave to dice
20:50
<
azonenberg >
Go for like 5mm or so dies
20:50
<
azonenberg >
maybe 10mm even
20:51
<
azonenberg >
Then for each die, strip the temporary photoresist off
20:51
<
azonenberg >
Coat new resist, contact litho for the metallization pattern
20:52
<
azonenberg >
Develop and etch with HCl:H2O2
20:52
<
azonenberg >
Now I have a metallized die with bond pads and some wires connecting bond pads to each other on a silicon substrate that is electrically isolated from the metal
20:53
<
azonenberg >
Then coat spin-on glass, bake, coat photoresist, contact litho for pad etch pattern
20:53
<
ai6ci >
muriatic+peroxide ftw.
20:53
<
azonenberg >
HF etch to open windows in the overglass
20:53
<
azonenberg >
Then put a tiny dab of flux and a solder ball on each pad and reflow
20:53
<
azonenberg >
Now i have a flip-chip BGA
20:54
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20:54
<
azonenberg >
just waiting to have a bit more spare cash to make this happen
20:54
<
azonenberg >
ai6ci: What do you think of the process? Seem plausible?
20:54
<
azonenberg >
It seems like it would be a lot easier than wirebonding
20:54
<
ai6ci >
We talked about it last night already.
20:55
<
azonenberg >
oh, ok
20:55
<
azonenberg >
Anyway i just was browsing a few places looking for some ideas
20:55
<
azonenberg >
and materials
20:56
<
ai6ci >
Yea, well did you kind of jump start your interest in this recently, cause you seem like ur about to do it :)
20:56
<
azonenberg >
I was the original creator of the channel
20:56
<
azonenberg >
but i've been away from it for a while
20:56
<
ai6ci >
I know that too, but I meant this specific fab
20:56
<
azonenberg >
i'm graduating in a few months and will be losing my access to the evaporator
20:56
<
ai6ci >
Yesterday it seemed like an idea you had but not something you were going to be doing in 2 weeks or so.
20:56
<
azonenberg >
So i want to do whatever processing requires it soonish
20:56
<
ai6ci >
you also mentioned just building an evap :)
20:57
<
azonenberg >
get a bunch of metallized substrates and then do litho testing in my spare time as I find it
20:57
<
azonenberg >
And well, that is on the long-term roadmap
20:57
<
azonenberg >
But I'm trying to take advantage of resources I have available when I can
20:58
<
azonenberg >
So the plan is to get one or two of those oxide-coated 4" wafers, evaporate metal stack onto them
20:58
<
azonenberg >
Cleave a piece off and look at it under the SEM to characterize layer thicknesses
20:58
<
azonenberg >
and otherwise leave them sitting in a cassette until I have more spare time
20:59
<
azonenberg >
i figure if i photoresist-coat the wafer right after metallizing that should keep it relatively safe
20:59
<
azonenberg >
from oxidation I mean
21:03
<
ai6ci >
oshpark for small hobby SMT type boards with SOIC probably the cheapest?
21:03
<
azonenberg >
for low volume of small pcbs, yes
21:03
<
ai6ci >
I've never used them for stuff like that I home etch, but I want to try it.
21:03
<
azonenberg >
once your board gets more than 100x150mm or so, a "real" fab might be worth it
21:04
<
azonenberg >
Or if you need more layers etc
21:05
<
ai6ci >
eurocard is like 100mm x 160mm, i think halfsies are 100mm x 80mm
21:05
<
ai6ci >
ill have to price it out then
21:05
<
ai6ci >
might work better and less hassle.
21:05
<
azonenberg >
ai6ci: They work in english units
21:06
<
azonenberg >
for 2-layer boards, 3 pcbs, $5 per square inch
21:06
<
azonenberg >
4-layer is $10 per square inch
21:06
<
ai6ci >
Yea well I work in my head in english units but PCB stuff I have lots of reference and intuition.
21:06
<
azonenberg >
I have a eurocard rack but so far have not made a full-depth one
21:06
<
ai6ci >
( for meters and the like ) :)
21:06
<
azonenberg >
Most of my boards have been faceplate connectors plus DC barrel jacks on the back
21:06
<
azonenberg >
So depth is irrelevant
21:06
<
ai6ci >
what faceplate connector do you use?
21:07
<
azonenberg >
RJ45 typically, for ethernet
21:07
<
azonenberg >
Or USB
21:07
<
azonenberg >
It depends on what the board does
21:07
<
azonenberg >
now that emulsitone is discontinuing a lot of their nice products
21:10
<
_Sync__ >
azonenberg: yes
21:10
<
azonenberg >
_Sync__: What was the process like?
21:10
<
azonenberg >
ai6ci: My TDR is currently the largest board i've ever designed
21:10
<
azonenberg >
it's just short of full depth eurocard
21:10
<
azonenberg >
100 x 140
21:11
<
_Sync__ >
those are made on (100) Si, 4", 0.5Ohmsq Boron
21:11
<
_Sync__ >
first was 750nm wet oxide
21:11
<
_Sync__ >
15nm anti channeling oxide
21:11
<
_Sync__ >
40keV As implant
21:12
<
_Sync__ >
front/back metal
21:12
<
_Sync__ >
10^15N/cm² dose
21:12
<
azonenberg >
_Sync__: Ion implant? Is this a homebrewed setup or do you have access to "real" gear?
21:13
<
azonenberg >
also these are through-wafer diodes?
21:13
<
_Sync__ >
basically
21:13
<
azonenberg >
Not planar?
21:13
<
_Sync__ >
525µ thickness
21:13
<
azonenberg >
I'm used to diodes made on an IC with a P-well inside an N-well
21:13
<
azonenberg >
or vice versa
21:13
<
azonenberg >
Why do you need litho at all for a through-die diode?
21:14
<
_Sync__ >
because you want to structure the fieldoxide and the front metal
21:14
<
_Sync__ >
otherwise you have one huge diode
21:14
<
_Sync__ >
which is not very useful at all
21:14
<
azonenberg >
I thought that's what you were doing
21:14
<
azonenberg >
like a discrete diode
21:14
<
azonenberg >
Not entirely clear on what you're trying to make
21:14
<
_Sync__ >
I made some diodes
21:14
<
azonenberg >
So several independent diodes on one substrate?
21:14
<
_Sync__ >
with 1000-50µm feature size
21:14
<
azonenberg >
But with vertical current flow
21:15
<
_Sync__ >
about 10k of them
21:15
<
azonenberg >
through the wafer
21:15
<
azonenberg >
ah, ok
21:16
<
_Sync__ >
and yeah I worked with real stuff
21:16
<
_Sync__ >
but most of the process was drawn out of my ass
21:16
<
azonenberg >
What was the point of making diodes?
21:16
<
_Sync__ >
seeing if they work
21:16
<
azonenberg >
As in, what was the experimental part?
21:16
<
azonenberg >
Was it to familiarize yourself with the equipment?
21:16
<
_Sync__ >
we have some process control issues
21:16
<
_Sync__ >
and making diodes is easy
21:16
<
azonenberg >
Ah, ok
21:17
<
azonenberg >
So ths goal was to characterize the implants?
21:17
<
_Sync__ >
nope, mostly the RTA stage
21:17
<
azonenberg >
I'm less familiar with the FEOL stuff
21:17
<
_Sync__ >
which as you can see killed the poor diodes
21:17
<
azonenberg >
Which is why I plan to build a BEOL first
21:18
<
azonenberg >
inert devices that consist of metallization (potentially multi-level eventually) on top of field oxide
21:18
<
azonenberg >
with a flip chip bga package
21:18
<
_Sync__ >
yeah that's easy to do
21:18
<
azonenberg >
And use that to get litho working reliably
21:18
<
azonenberg >
I dont have to worry about trace metals etc for the BEOL too
21:19
<
azonenberg >
As far as FEOL i was thinking of doing the following
21:19
<
azonenberg >
Spincoat spin-on glass
21:19
<
_Sync__ >
I still don't know what killed the diodes, I suppose Al spiking
21:19
<
azonenberg >
Litho for areas I want doped
21:19
<
azonenberg >
HF etch windows
21:19
<
azonenberg >
Spincoat dopant
21:19
<
azonenberg >
Diffusion bake
21:19
<
azonenberg >
then strip
21:20
<
azonenberg >
As far as isolation I'm wondering about how hard it would be to do STI
21:20
<
_Sync__ >
depending on how planar you want to be afterwards, easy or shitty
21:20
<
azonenberg >
alternatively, if i want to cheat a little bit
21:20
<
_Sync__ >
because you'd need to do CMP
21:20
<
azonenberg >
Yeah I would
21:20
<
azonenberg >
I have an idea to chea
21:20
<
azonenberg >
Use SOI
21:21
<
azonenberg >
cheat*
21:21
<
azonenberg >
Use SOI and then etch with TMAH all the way through the upper silicon layer
21:21
<
_Sync__ >
if you want to spend the money for thin top Si SOI wafers
21:21
<
azonenberg >
Such that each transistor is completely isolated from the rest
21:21
<
azonenberg >
The goal, I think, would be to make functional devices first
21:21
<
azonenberg >
Then to cut costs
21:22
<
azonenberg >
I dont expect to be processing full wafers either
21:22
<
azonenberg >
Buy like a 6" wafer and pre-dice into 1cm dies
21:22
<
azonenberg >
then do all of my processing in the center of one of those dies
21:22
<
azonenberg >
One at a time
21:22
<
azonenberg >
Heck, i could pull a Jeri and use a CPU fan as a spin coater :
21:23
<
_Sync__ >
you can just buy a used one on ebay
21:23
<
_Sync__ >
you are also lucky because there are proper mask aligners all around
21:23
<
azonenberg >
That takes up more lab space
21:23
<
azonenberg >
And yes, I'm aware
21:23
<
_Sync__ >
although getting one to work sucks ass
21:23
<
_Sync__ >
ours is misaligned
21:23
<
_Sync__ >
the upper wafer half is basically unusable
21:23
<
azonenberg >
The short term plan is to do whatever I can do quickly before graduating
21:23
<
azonenberg >
Things like making wafers with various stacks of metallization for future litho testing
21:24
<
azonenberg >
Then move across the country, get settled into my new job, spend a year or two doing planning and stuff while saving for a house
21:24
<
azonenberg >
Then once I have a place to build a proper lab, well...
21:24
<
azonenberg >
Build a proper lab :p
21:29
<
azonenberg >
too bad i dont have either the cash or a place to put it
21:29
<
azonenberg >
this looks quite nice and the price is, while not great, not terrible
21:30
<
_Sync__ >
it's pretty steep for one that doesn't even feature joysticks
21:31
<
_Sync__ >
but that might in the end be better because there are no electronics to go wrong
21:31
<
azonenberg >
i've seen a very similar one in use
21:31
<
azonenberg >
i want one that is simple
21:31
<
azonenberg >
Most on ebay that I see are >20K
21:31
<
azonenberg >
I dont have that kind of cash, but it looks less pricey than much of the competition
21:32
<
_Sync__ >
we have a karl süss MA
21:32
<
_Sync__ >
pretty nice thing
21:32
<
_Sync__ >
especially because it has the microscope over the wafer station
21:32
<
_Sync__ >
so nothing moves when you expose
21:33
<
azonenberg >
the OAI we have at RPI has a track with the microscope and exposure head sliding over a fixed wafer+mask stage
21:34
<
_Sync__ >
yeah I guess that works for research
21:35
<
azonenberg >
Yeah, it's meant for one-off prototype runs
21:35
<
_Sync__ >
we sometimes do 50 wafers in a run
21:35
<
azonenberg >
this is at IMEC? Or am I forgetting
21:35
<
_Sync__ >
so a production one makes sense
21:36
<
_Sync__ >
I'm not in belgium
21:36
<
azonenberg >
i'm losing track of who's where
21:36
<
azonenberg >
i thought someone here was at IMEC
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